13.08.2012 apg2c1 -1050 1 / 3 apg2c1 - 1050 ir high power single chip led apg2c1 - 1050 is a gaalas based, high power 1050 nm single chip led in standard emitter package for general application. specifications ? str ucture: gaalas ? peak wavelength: 1050 nm ? optical outpu t power: typ. 50 mw ? life time: > 10.000 hours ? housing: standard emitter package absolute maximum ratings (t a =25c) parameter symbol value unit power dissipation, dc p d 1000 mw forward current, dc i f 500 ma pulsed current (1% duty cycle, 1khz) i fp 1000 ma reverse voltage u r - 5 v operating temperature t opr - 30 ? +70 c storage temperature t stg - 30 ? +85 c soldering temperature (max. 1,5 s) t sol 330 c electro - optical characteristics (t a =25c) parameter symbol condition min. typ. max. unit forward current i f - 350 - ma viewing angle i f = 350 ma 75 d eg. cw output power p o i f = 350 ma 50 mw peak wavelength p i f = 350 ma 1050 nm forward voltage u f i f = 350 ma - 1.2 - v half width (fwhm) ? i f = 350 ma - 47 nm wavelength measurements tolerance is +/ - 2% output p ower measurement tolerance is +/ - 10% voltage measurement tolerance is +/ - 2% device materials item material foundation plastic lens acryl electrodes agcu heat sink agcu
13.08.2012 apg2c1 -1050 2 / 3 typical performance characteristics normalized o utput p ower vs. wavelength : outline dimensions emitter: radiation pattern (lambertian lens without optics) relative intensity vs. angular displacement
13.08.2012 apg2c1 -1050 3 / 3 soldering conditions reflow soldering: apg2c1 leds have a maximum storage temperature of 85. therefor it is not possible to use a reflow soldering process for array assembly! hot bar soldering: a hot bar soldering process is recommended when soldering apg2c1 emitters. this process will only t ransfer heat to the leads and avoids overheating the emitter which will damage the device. in order to transfer sufficient heat from the hot bar to the device, following parameters must be carefully considered: ? amount of flux ? pressing force of solder tip ? h ot bar temperature for the standard assembly process, following parameters should be maintained: ? hot bar temperature: 330 c ? force of hot bar. 40 n ? soldering time: 1.5 s it is recommended to use a copper nickel - plated hot bar mounted to standard temperatur e controlled soldering equipment. manual hand soldering: for prototype build or small series production runs, it is possible to place and solder the emitters by hand. it is therefore recommended to maintain the following parameters: ? solder tip temperature 3 30 c ? soldering time. < 1.5 s ? junction temperature must be kept below 70 c a visual inspection may be used to check the quality of the solder joint general soldering precautions: ? mechanical stress, shock and vibration must be avoided during soldering ? on ly use non corrosive flux. ? do not apply current to the device until it has cooled down to room temperature after soldering.
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